Taw qhia
Niaj hnub no cov digital era, CMOS duab sensors tau dhau los ua cov khoom tseem ceeb hauv kev lag luam xws li smartphones, kev soj ntsuam kev ruaj ntseg, tsheb hluav taws xob, thiab khoom siv kho mob. Txawm li cas los xij, qhov kev ua tau zoo ntawm lub nti sensor nyob ntawm nws tus kheej tsis tsuas yog tsim thiab tsim khoom, tab sis kuj tseem cuam tshuam rau cov txheej txheem ntim khoom. Kev ntim khoom tiv thaiv cov nti tsis yooj yim los ntawm ib puag ncig ib puag ncig (xws li plua plav, noo noo, thiab kev ntxhov siab ntawm cov tshuab) thiab yog lub luag haujlwm tsim kom muaj kev sib txuas hluav taws xob thiab kev tswj xyuas thermal ntawm cov nti thiab cov hluav taws xob sab nraud. Nws cuam tshuam ncaj qha rau lub sensor qhov kev ua tau zoo, qhov loj me, tus nqi, thiab kev ntseeg siab ..
Ntawm ntau lub tshuab ntim khoom, CSP, COB, thiab PLCC yog peb cov txheej txheem tseem ceeb hauv CMOS sensor teb. Txhua tus muaj nws cov txheej txheem tshwj xeeb ntws, cov yam ntxwv ntawm kev ua haujlwm, thiab kev siv scenarios. Kab lus no yuav muab ib qho kev ntsuam xyuas qhov tob ntawm peb txoj kev ntim khoom no, pab cov neeg nyeem kom nkag siab txog lawv qhov sib txawv thiab cov txheej txheem xaiv los ntawm kev txheeb xyuas sib piv.
I. Kev piav qhia ntxaws txog cov txheej txheem ntim khoom
1. CSP - Chip Scale Package
CSP sawv cev rau Chip Scale Package. Raws li lub npe implies, nws qhov tseem ceeb feature yog hais tias lub pob loj yog ze li zoo tib yam rau cov tub ntxhais loj ntawm lub nti nws tus kheej. Raws li tus qauv, qhov piv ntawm cov tub ntxhais hauv cheeb tsam rau lub pob cheeb tsam feem ntau tsis tshaj 1: 1.1.
Txheej txheem Flow:
CSP yog ib daim ntawv ntim ua tiav ntawm qib wafer. Cov txheej txheem yooj yim cuam tshuam ncaj qha ua cov microlenses thiab cov xim lim dej (yog tias xav tau) ntawm qhov ua tiav Circuit wafer, ua raws li kev tsim cov pob kab sib chaws los ntawm cov txheej txheem sib tsoo, thiab thaum kawg dicing lub wafer rau hauv ib tus neeg sensor units. Hauv kev tsim lub koob yees duab module, sensors siv CSP ntim yog feem ntau mounted ncaj qha mus rau PCB siv SMT qhov chaw tshuab.
2. COB - Chip On Board
COB sawv cev rau Chip On Board. Qhov no yog ib lub tshuab ntim khoom uas cov liab qab tuag yog ncaj qha mounted thiab hluav taws xob txuas mus rau lub rooj tsav xwm zaum kawg.
Txheej txheem Flow:
Cov txheej txheem COB yog qhov nyuaj dua, feem ntau ua rau ntawm tus kheej nti, thiab feem ntau yuav tsum muaj Chav Kawm 1000 lossis txawm tias Chav Kawm 100 chav huv.
- Tuag Txuas: Lub diced liab qab nti (Tuag) yog txuas rau qhov chaw nyob ntawm PCB siv thermally conductive epoxy resin (xws li, nyiaj muab tshuaj txhuam).
- Curing: Cov nyiaj muab tshuaj txhuam yog kho los ntawm cua sov, khov kho cov nti.
- Hlau Bonding: Siv cov kub los yog txhuas cov xov hlau, cov ntaub qhwv ntawm cov nti txuas nrog cov ntaub qhwv sib txuas ntawm PCB los ntawm kev sib txuas ntawm cov thermocompression, ultrasonic vuam, los yog thermosonic vuam.
- Kev kuaj thiab sealing: Kev kuaj hluav taws xob ua ntej tau ua tiav. Ib qho tshwj xeeb dub epoxy lossis resin yog tom qab ntawd muab faib los npog cov nti thiab cov xov hlau kub rau kev tiv thaiv. Qhov no yog ua raws li kev kho zaum kawg thiab kev sim siab kawg.
3. PLCC - Yas Leaded Chip Carrier
PLCC sawv cev rau Plastic Leaded Chip Carrier. Nws yog hom qub saum npoo-mount pob qhov twg cov hlau lead txuas mus los ntawm tag nrho plaub sab ntawm lub cev pob thiab khoov rau hauv "J"- lead configuration.
Txheej txheem Flow:
- PLCC ntim nrog ua ntej- ntim cov nti los ua ib qho kev ywj pheej nrog tus qauv zoo thiab tus pins.
- Lub nti yog txuas rau ib qho txhuas ncej.
- Kev sib txuas hluav taws xob sab hauv yog tsim los ntawm kev sib txuas xov hlau
- Lub rooj sib txoos yog molded thiab encapsulated nrog cov khoom yas ..
- Cov tsim PLCC sensor, raws li tus qauv tivthaiv, yog mounted rau PCB siv reflow soldering.
II. Cov lus sib piv ntawm cov yam ntxwv tseem ceeb
| Sib piv Dimension |
CSP Ntim
|
PLCC Ntim
|
COB Ntim
|
| Cov qauv pob | Bracket-dawb, direct chip ntim | Lub cev pob yas + J- zoo li tus pins + txhuas ncej | Npuag nti ncaj qha mounted ntawm PCB, hlau sib txuas + potting |
| Loj | Tsawg tshaj plaws (kwv yees li 1.2 npaug ntawm cov nti loj) | Nruab nrab (me dua DIP, loj dua CSP) | Me me (tsis muaj lub cev pob khoom ywj pheej, qhov siab qis tshaj) |
| Pin yam ntxwv | Tsis muaj pins raug, txuas nrog pob | J-zoo li tus sab hauv nkhaus, 18-84 tus pin | Tsis muaj tus pins ywj pheej, txuas nrog kev sib txuas ntawm cov xov hlau |
| Ntim Cov Nqi | Kev sib piv siab (cov txheej txheem nyuaj, chav tsev nqi 3-5 npaug ntawm SMD) | Nruab nrab (cov khoom sib npaug thiab cov nqi txheej txheem) | Tsawg tshaj plaws (tshem tawm bracket thiab cov txheej txheem ntim khoom ywj pheej) |
| Thaum tshav kub kub Dissipation Performance | Zoo (nyias ntim txheej, siab thermal conductivity) | Qhov nruab nrab (thermal kuj muaj nyob rau hauv lub hnab yas lub cev) | Zoo (kev sib cuag ncaj qha ntawm nti thiab PCB) |
| Kev ntseeg tau | Nruab nrab (nruab nrab cuam tshuam tsis kam, susceptible to contamination) | Kev sib tw siab (cov ntim yas + txhuas ncej tiv thaiv, zoo txhua yam muaj zog) | Nruab nrab (potting tiv thaiv, tsis tshua muaj neeg tuag pixel tus nqi tab sis yooj yim rau kev cuam tshuam nyuaj) |
| Kev ruaj ntseg | Ib qho yooj yim heev (reworkable rau qhov chaw paug) | Zoo sib xws yooj yim (pins yooj yim rau disassemble, yooj yim rau rework) | Qhov nyuaj heev (cov chips liab qab tsis tuaj yeem hloov ib tus zuj zus tom qab potting) |
| Daim ntawv thov | Miniaturized, siab - cov khoom siv ua tau zoo | Nruab nrab- circuits complex, ib txwm siv hluav taws xob | Tus nqi - cov xwm txheej tseem ceeb nrog cov kev xav tau xoob loj |
III. Paub meej qhov zoo thiab qhov tsis zoo ntawm txhua txoj kev ntim khoom
CSP Ntim
Qhov zoo:
- Ultra- qhov loj me txhawb nqa qhov me me ntawm cov khoom siv davhlau ya nyob twg, tshwj xeeb tshaj yog tsim rau cov koob yees duab micro hauv xov tooj ntawm tes, smart watches, thiab lwm yam, txo qhov ntsuas qhov loj me thiab txuag qhov chaw rau lub lens modules.
- Kev ua tau zoo ntawm hluav taws xob zoo: Cov kev sib tshuam luv luv txo cov teeb liab poob thiab txhim kho cov ntaub ntawv kis ceev
- Kev ua haujlwm zoo thaum tshav kub kub dissipation: Cov txheej ntim nyias nyias thiab tsis muaj kev cuam tshuam ntawm lub bracket ua kom yooj yim rau cua sov los ntawm lub sensor.
Disadvantages:
- Cov txheej txheem siab precision yuav tsum ua rau cov nqi ntim ntau dua li ob txoj hauv kev.
- Kev xa tawm lub teeb tsis zoo: Cov iav tiv thaiv nto tuaj yeem ua rau ghosting vim backlight nkag, cuam tshuam cov duab zoo ntawm CMOS sensors.
- Tsis muaj kev sib kis tsis zoo: Txawm hais tias rov ua haujlwm dua, nws tseem muaj qee qhov kev xav tau rau qhov chaw tsim khoom.
PLCC Ntim
Qhov zoo:
- Kev ntseeg siab: Kev sib xyaw ntawm cov hnab yas lub cev thiab cov hlau lead thav duab muab kev cuam tshuam zoo heev thiab kev co kuj
- Yooj yim installation thiab rework: J-puab pins pab txhawb reflow soldering thiab yooj yim rau disassemble.
- Lub teeb liab kev ua tau zoo: Tsim nyog tus pin pitch txo cov crosstalk ntawm tus pins, haum rau nruab nrab -ceev teeb liab kis tau tus mob.
Disadvantages:
- Cov pob loj loj ua rau nws tsis tuaj yeem ua tau raws li qhov kev xav tau ntawm micro CMOS sensors.
- txwv tus pin ceev, ua rau nws nyuaj rau hloov mus rau complex sensor chips nrog ntau tus pins
- Qhov nruab nrab kub dissipation kev ua tau zoo: Cov thermal conductivity tsawg ntawm cov ntaub ntawv yas ua rau nws tsis haum rau siab - fais fab sensors.
COB Ntim
Qhov zoo:
- Tus nqi tseem ceeb: Tshem tawm cov hlua khi thiab cov txheej txheem ntim khoom ywj pheej, ua rau cov khoom siv qis tshaj plaws thiab cov nqi txheej txheem.
- Qhov siab ntim qis tshaj plaws, pab txhawb rau tag nrho cov thinness ntawm lub module thiab haum rau cov khoom rhiab rau thickness ..
- Cov txheej txheem paub tab thiab kev koom ua ke siab: Txhawb ntau -chip co- substrate ntim, nrog rau tus nqi pixel tuag tswj tsis pub dhau 5 rau 100,000.
Disadvantages:
- Kev tswj tsis tau zoo heev: Cov chips liab qab tsis tuaj yeem hloov pauv ib tus zuj zus tom qab potting, yuav tsum tau hloov tag nrho substrate thaum tsis ua hauj lwm.
- Cov kev cai nruj rau qhov chaw tsim khoom: PCB mounting yuav tsum muaj plua plav thiab noo noo tiv thaiv, vim cov chips liab qab yuav raug cuam tshuam rau kev sib kis.
- Lub sijhawm ua haujlwm ntev thiab kev hloov pauv loj hauv cov txiaj ntsig tawm los, yuav tsum tau tswj cov txheej txheem nruj.
IV. Qhov txawv tshwj xeeb hauv CMOS Sensors
1. Qhov loj thiab daim ntawv Adaptability
- CSP ntim yog qhov kev xaiv tseem ceeb rau kev ua haujlwm me me ntawm CMOS sensors, tshwj xeeb tshaj yog rau cov koob yees duab micro hauv cov khoom siv nqa tau xws li xov tooj ntawm tes thiab smartwatches. Nws tuaj yeem txo qhov ntsuas qhov loj me thiab txuag chaw rau lens modules ..
- Vim muaj kev txwv loj, PLCC ntim tsuas yog siv nyob rau hauv ob peb lub CMOS sensors nrog xoob qhov yuav tsum tau, xws li cov koob yees duab soj ntsuam thaum ntxov los yog industrial low - daws teeb meem sensors, thiab tau maj mam hloov.
- Txawm hais tias COB ntim muaj qhov siab qis tshaj plaws, nws xav tau qhov chaw tshwj xeeb rau kev sib txuas thiab potting. Nws feem ntau yog siv nyob rau hauv sensor modules rhiab rau tus nqi thiab nrog xoob loj txwv, xws li kev soj ntsuam kev ruaj ntseg thiab tom qab -kev ua lag luam cov khoom siv tsheb.
2. Kev cuam tshuam rau kev ua tau zoo
- Lub iav tiv thaiv nto ntawm CSP ntim txo cov teeb pom kev zoo, uas tuaj yeem cuam tshuam qhov rhiab heev ntawm CMOS sensors. Optical tsim optimization yuav tsum tau offset ghosting ..
- Lub hnab yas lub cev thiab tus pin layout ntawm PLCC ntim muaj kev cuam tshuam me ntsis ntawm lub teeb, tab sis txoj kev teeb liab ntev dua li ntawm CSP, uas tuaj yeem ua rau lub teeb liab qeeb hauv siab -speed imaging sensors.
- COB ntim tsis muaj txheej ntim ntxiv los thaiv lub teeb, theoretically ua tiav lub teeb rhiab heev. Txawm li cas los xij, cov chips liab qab raug ncaj qha rau potting; Kev tiv thaiv plua plav tsis raug tuaj yeem ua rau stains ntawm lub sensor nto, cuam tshuam rau kev ua haujlwm zoo.
3. Cov txheej txheem thiab tus nqi tswj
- CMOS sensors nrog CSP ntim muaj lub sijhawm luv luv thiab cov khoom siv qis tab sis tus nqi siab nti. Lawv haum rau nruab nrab - mus rau - siab -kawg flagship li nrhiav kev ua tau zoo thiab loj.
- Sensors nrog PLCC ntim muaj cov txheej txheem zoo sib xws thiab cov nqi kho mob tsawg tab sis cov nqi khoom ntau dua li COB. Lawv tsim nyog rau kev lag luam sensors nrog kev ntseeg siab.
- Sensors nrog COB ntim muaj cov nqi ntim qis tshaj plaws tab sis xav tau kev nqis peev loj hauv cov txheej txheem cov cuab yeej thiab ntsib teeb meem hauv kev tswj hwm tus nqi. Lawv tsim nyog rau nruab nrab-rau- qis- cov neeg siv khoom kawg- qib sensors lossis pawg- tsim cov khoom soj ntsuam.
4. Environmental Adaptability
- CSP- ntim cov sensors muaj qhov tsis muaj zog tiv thaiv thiab ua rau tsis ua haujlwm hauv qhov chaw hnyav, ua rau lawv tsim nyog rau cov xwm txheej kub hauv tsev.
- PLCC- ntim cov sensors muaj kev tiv thaiv zoo thiab ruaj khov J- zoo li tus pin sib txuas, yoog mus rau ib puag ncig hnyav xws li kev siv tsheb thiab kev lag luam.
- COB-cov sensors ntim tau ua tiav IP65-theem tiv thaiv los ntawm potting, tsis muaj cov ces kaum tuag hauv kev kho mob. Lawv muaj zog tiv taus cov av noo, tshav kub, thiab ntsev tsuag, haum rau cov cheeb tsam nyuaj xws li kev soj ntsuam sab nraum zoov.
V. CMOS Sensor Ntim Cov Lus Pom Zoo
1. Cov khoom siv hluav taws xob (smartphones, smart wearables).
- Core xav tau: me me, siab pixel, ceev cov ntaub ntawv kis tau tus mob
- Pom zoo: CSP ntim
- Yog vim li cas: Fits nyias / lub teeb tsim, txo cov teeb liab poob kom pom tseeb siab -res duab; ceeb toom: tus nqi sib npaug rau nruab nrab-qis- khoom kawg.
2. Kev soj ntsuam kev ruaj ntseg, qis -cov koob yees duab ntse hauv tsev
- Cov kev xav tau tseem ceeb: Tus nqi qis, ruaj khov ntev - siv sijhawm
- Pom zoo: COB ntim
- Yog vim li cas: Txuag cov nqi ntim khoom, zoo cua sov dissipation; Nco tseg: ua kom huv si kom tsis txhob muaj cov duab stains.
3. Ib txwm muaj kev tshawb nrhiav, cov cuab yeej tswj tau
- Cov kev xav tau tseem ceeb: kho yooj yim, tiv thaiv -kev co
- Pom zoo: PLCC ntim (ntxiv ntxiv).
- Yog vim li cas: Yooj yim rau disassemble, ruaj; ceeb toom: tsis yog rau siab -pixel/small- sensors loj.
Cov ntsiab lus
CSP, COB, thiab PLCC ntim tshuab tsim peb lub hauv paus rau kev siv CMOS duab sensors. Txhua tus muaj nws tus kheej qhov zoo thiab qhov tsis zoo, ua raws li kev xav tau ntawm kev lag luam sib txawv thiab qhov chaw ntawm cov khoom. CSP, nrog nwscompactness thiab kev khwv nyiaj txiag, muaj koob yees duab nrov; COB tuav lub lag luam siab - kawg nrog nwskev ua tau zoo heev thiab kev ntseeg tau; thaum PLCC tau pom txoj kev txhim kho ntawm cov tshuab ntim khoom thiab tseem ua lub luag haujlwm hauv cov haujlwm tshwj xeeb.
Raws li thev naus laus zis txuas ntxiv mus, kev ntim khoom siab dua thiab kev koom ua ke thev naus laus zis nyiamTig-ChipthiabWafer{0}}Level Opticstseem tab tom txhim kho. Txawm li cas los xij, nkag siab txog cov txheej txheem ntim khoom tseem ceeb thiab tseem ceeb no-CSP, COB, thiab PLCC- yog qhov tseem ceeb rau cov khoom tsim, tsim, thiab xaiv, ua tus yuam sij rau kev qhib lub ntiaj teb ntawm CMOS sensor daim ntawv thov.
